For the purposes of soldering surface mount components, pads on outer layers are typically referred to as lands or solder lands. Making electrical connections to these lands usually requires vias. Due to manufacturing constraints of PTH technology, it is rarely possible to place a via inside the area of the land. Instead, this technology uses a short section of trace connecting to a surface pad. The minimum length of the connecting trace is determined by minimum dimension specifications from the PCB manufacturer. Microvia technology is not constrained, and vias can be placed directly in the area of a solder land.