RLDRAM 3 Memory Address and Command Clamshell Routing and Termination

UltraScale Architecture PCB Design User Guide (UG583)

Document ID
UG583
Release Date
2023-11-14
Revision
1.27 English

Using clamshell topology, each address and command signal is routed to opposite memory devices with matched topologies due to the mirroring ability of RLDRAM 3 devices (This Figure).

Figure 2-62:      Address and Command Clamshell Routing for Clamshell-mounted RLDRAM 3 Memories

X-Ref Target - Figure 2-62

ug583_c2_28.jpg

Table: Clamshell Routing Impedance, Length, and Spacing Guidelines for Address and Command Signals shows the clamshell routing impedance, length, and spacing guidelines for address and command signals.

Table 2-73:      Clamshell Routing Impedance, Length, and Spacing Guidelines for Address and
Command Signals

Parameter

L0
(Device Breakout)

L1
(Main PCB)

L2
(DRAM Breakout)

L3
(To RTT)

Units

Trace type

Stripline

Stripline

Stripline

Stripline

Single-ended impedance Z0

50±10%

39±10%

50±10%

39±10%

W

Trace width

4.0

6.0

4.0

6.0

mil

Trace length

0.0~0.8/1.2(1)

0.0~4.0

0.0~0.25

0~1.0

inches

Spacing in address and command signals (minimum)

4.0

8.0

4.0

8.0

mil

Spacing to clock signals (minimum)

8.0

20

8.0

20

mil

Spacing to other group signals (minimum)

8.0

30

30

30

mil

Maximum PCB via count

6

Notes:

1.See item 2 in General Memory Routing Guidelines.