RLDRAM 3 Memory DK_P/N and QK_P/N Differential Point-to-Point Routing

UltraScale Architecture PCB Design User Guide (UG583)

Document ID

UG583

Release Date

2023-11-14

Revision

1.27 English

This Figure and This Figure show the RLDRAM 3 memory dk_p/n and qk_p/n differential point-to-point routing.

Figure 2-66: dk_p/n Point-to-Point Routing
X-Ref Target - Figure 2-66

Figure 2-67: qk_p/n Point-to-Point Routing
X-Ref Target - Figure 2-67

Table: RLDRAM 3 Memory Impedance, Length, and Spacing Guidelines for dk and qk Signals shows the RLDRAM 3 memory impedance, length, and spacing guidelines for dk and qk signals.

Table 2-77: RLDRAM 3 Memory Impedance, Length, and Spacing Guidelines for dk and qk Signals
Parameter	L0 (Device Breakout)	L1 (Main PCB)	L2 (DRAM Breakout)	Units
Trace type	Stripline	Stripline	Stripline	–
ck/qk differential impedance Z_DIFF	86±10%	76±10%	86±10%	W
Trace width (nominal)	4.0	6.0	4.0	mil
Differential trace width/space/width	4.0/4.0/4.0	6.0/6.0/6.0	4.0/4.0/4.0	mil
Trace length (nominal)	0.0~0.8/1.2⁽¹⁾	0.0~4.0	0.0~0.25	inches
Spacing to other group signals (minimum)	8.0	30	30	mil
Maximum PCB via count	2			–
Notes: 1.See item 2 in General Memory Routing Guidelines.