•PCB and package skew between ALE/CE/CLE/IO[7:0] and WE/RE should be within ±100 ps.
•Place 4.7 kW pull-up resistors on CE and RB near the NAND device.
•PCB and package skew between ALE/CE/CLE/IO[7:0] and WE/RE should be within ±100 ps.
•Place 4.7 kW pull-up resistors on CE and RB near the NAND device.