If migrating from a bigger device to a smaller device within the same package, there exists the potential for some I/O and transceiver banks to not be bonded out or present on the smaller device. Figure 1 shows a snippet of the I/O migration table from Versal Adaptive SoC Packaging and Pinouts Architecture Manual (AM013). XPIO banks 703, 704, 705, 803, 804, and 805 are not bonded on VM1302 in the D1760 package while the same are available on the VM1402 device.
Figure 1. Snippet of I/O Migration Table
