The PCB should be designed considering the fastest signal interfacing with the device. These high-speed signals are extremely sensitive to trace geometry, vias, loss, and crosstalk. These aspects become even more prominent for multi-layer PCBs. For high-speed interfaces perform a signal integrity simulation. A board redesign with improved PCB material or altered trace geometries might be necessary to obtain the desired performance.
AMD recommends following these steps when designing your PCB:
- Review the following device documentation:
- PCB Design Guide for your device.
- Board design guidelines in the transceiver user guide for your device.
- Review memory IP and PCIe® design guidelines in the IP product guides.
- Use the Vivado tools to validate your
- Run simultaneous switching noise (SSN) analysis.
- Run built-in DRCs.
- Export I/O buffer information specification (IBIS) models.
- Run signal integrity analysis as follows:
- For gigabit transceivers (GTs), run Spice or IBIS-AMI simulations using channel parameters.
- For lower performance interfaces, run IBIS simulation to check for issues with overshoot or undershoot.
- Use the Xilinx Power Estimator (XPE) spreadsheet tool (download at www.xilinx.com/power) with Process set to Maximum to generate an early estimate of the power consumption for the design.
- Complete and adhere to the schematic checklist for your device.
- Manually add XDC operating condition constraints to your XDC file for the Vivado tools.Use the XPE tool to generate a Xilinx design constraints (XDC) file, and import this file into the corresponding Vivado project. The XPE tool environment settings are translated to XDC constraints. The estimated total on-chip power becomes the design power budget for Vivado power analysis. For more information, see the Vivado Design Suite User Guide: Power Analysis and Optimization (UG907).