Abstract

A Technique to Reduce Cross Talk Between Copper Routes Under a 1 mm Pitch BGA (WP547)

Document ID
WP547
Release Date
2022-09-23
Revision
1.0 English

This white paper describes a technique for reducing cross talk between copper routes in 1 mm pitch BGA devices. This method can be used with any integrated circuit device that uses a 1 mm BGA package. The technique is a printed circuit board (PCB) level solution, and is employed at the layout level of a design. This white paper is targeted for:

  • Printed circuit board design engineers
  • Simulation engineers
  • Layout engineers