Conclusion

A Technique to Reduce Cross Talk Between Copper Routes Under a 1 mm Pitch BGA (WP547)

Document ID
WP547
Release Date
2022-09-23
Revision
1.0 English

This white paper outlines a technique to reduce cross talk between copper routes by reducing the impedance to ground using more local ground vias. In the example described, the simulated gain was 3.74 dB at Nyquist. The via count between routes can be maximized by the careful selection of the pad or drill size. This use case might not be suitable for all designs. Care must be taken at the design stage to ensure that the final board can be manufactured.