Xilinx thermal models are available on the
Power Efficiency page of the Xilinx website. For UltraScale+ and prior device families, the models on the website
are DELPHI and often include the thermal characterization report. This report shares
details of the use of the model as well as how to reproduce the model on other
simulators. The document is available for most of the recent device families, but if the
document does not exist, you can request it.
Detailed thermal models are also available by request for most devices. For
devices and later, Xilinx
provides two forms of detailed models: simplified
and full detail. The simplified model is a material model that allows the thermal
results to be extracted without including the stiffener ring and other details in the
model. These additional package details often impact meshing and convergence of the
models, so it is suggested to use the simplified models for most thermal needs. The full
detail models include all package details and better represent the physical form factor
of the device.
Note: These models can have excessive
runtime and other undesirable characteristics, so it is not suggested for most
thermal simulation needs. These models are better suited for mechanical
3-D CAD models of the device packages are also available by request for most
Xilinx devices. It is suggested to use these to
ensure proper fitting of the heatsink prior to commitment for manufacturing.