- Identify the package lid type and associated documentation.
- Determine the contact area for the package and height
requirements.
- Design the heatsink base.
- Design fins and airflow (or fluid flow if liquid cooling).
- Design the proper attachment.
- Choose thermal interface material (TIM) and determine application.
- TIM is the substance used between the device and thermal
stack up, and is intended to improve thermal contact.
- Determine thermal parameters for simulation and validate thermal
solution.
- Determine proper assembly, test, and debug (if necessary).