Summary

Designing Heatsinks and Thermal Solutions for Xilinx Devices (XAPP1377)

Document ID
XAPP1377
Release Date
2022-06-06
Revision
1.0 English

This application note describes guidelines and best practices for designing heatsinks and thermal solutions for Xilinx® devices. It includes upfront considerations for selection, design, and test to adequately plan and execute a successful thermal solution for all Xilinx devices.