AMD Versal™ devices are packed in trays. Trays are used to pack most of AMD surface-mount devices because they provide excellent protection from mechanical damage. In addition, they are manufactured using antistatic material to provide limited protection against ESD damage and can withstand a bake temperature of 125°C.
| Package | Maximum Number of Devices Per Tray | Maximum Number of Units In One Internal Box |
|---|---|---|
| SBVA484 | 84 | 420 |
| SBVA625 | 60 | 300 |
| SFVA784 | 60 | 300 |
| NBVB1024 | 27 | 135 |
| NFVB1369 | 24 | 72 |
| NSVF1369 | 24 | 72 |
| NSVG1369 | 24 | 72 |
| NSVH1369 | 24 | 72 |
| NFVI1369 | 24 | 72 |
| VFVC1596 | 21 | 63 |
| VIVA1596 | 21 | 63 |
| VSVA1596 | 21 | 63 |
| VFVC1760 | 21 | 63 |
| VFVF1760 | 21 | 63 |
| VSVD1760 | 21 | 63 |
| VSVH1760 | 21 | 63 |
| VSVI1760 | 21 | 63 |
| VSVA2197 | 12 | 36 |
| VSVB2197 | 12 | 36 |
| VSVD2197 | 12 | 36 |
| VSVA2785 | 10 | 30 |
| VSVA3340 | 10 | 30 |
| VSVB3340 | 10 | 30 |
| VSVA3697 | 10 | 30 |
| LSVC4072 | 4 | 12 |
| LSVA4737 | 4 | 12 |
| VSVA5601 | 4 | 12 |
| VSVA6865 | 3 | 9 |
| VSVB6865 | 3 | 9 |
Important: All
packages are available with eutectic-SnPb BGA balls. To order these packages, the
device type starts with an XQ vs. XC or XA, and the Pb-free signifier in the package
name is Q (for example: VSRD1760).