AMD does not have information regarding the reliability of flip-chip BGA packages on a board after exposure to any specific conformal coating process. Therefore, any process using conformal coating should be qualified for the specific use case to cover the materials and process steps.
Ruggedized XQ packages are designed to support conformal coating, with vented lids that ensure proper cleaning can occur after the etching process and prior to conformal coating.
Recommended: When a conformal
coating is required, Parylene-based material should be used to avoid potential risk
of weakening the lid adhesive used in AMD
packages.