为多块设计生成和编译 BSP - 2023.2 简体中文

Vitis 统一软件平台文档 嵌入式软件开发 (UG1400)

Document ID
UG1400
Release Date
2023-12-13
Version
2023.2 简体中文
图 1. 在活动的顶层设计中包含多个块设计实例的设计示例
#打开含多个块设计实例的硬件设计
hsi% hsi::open_hw_design system_wrapper.xsa
design_1_wrapper
#获取硬件单元实例
注释: 显示来自顶层的所有块设计的单元实例,并且以所在层级作为其名称的前缀
hsi% join [get_cells ] \n
ps_0_wrapper_i_ps_0_i_processing_system7_0
ps7_uart_1
ps7_qspi_0
ps7_cortexa9_0
ps7_cortexa9_1
ps7_ddr_0
ps7_ethernet_0
....
mb_2_wrapper_i_mb_2_i_axi_gpio_0
mb_2_wrapper_i_mb_2_i_mdm_1
mb_2_wrapper_i_mb_2_i_microblaze_0
mb_2_wrapper_i_mb_2_i_microblaze_0_axi_periph
mb_2_wrapper_i_mb_2_i_microblaze_0_local_memory_dlmb_bram_if_cntlr
mb_2_wrapper_i_mb_2_i_microblaze_0_local_memory_dlmb_v10
mb_2_wrapper_i_mb_2_i_microblaze_0_local_memory_ilmb_bram_if_cntlr
mb_2_wrapper_i_mb_2_i_microblaze_0_local_memory_ilmb_v10
mb_2_wrapper_i_mb_2_i_microblaze_0_local_memory_lmb_bram
mb_2_wrapper_i_mb_2_i_rst_clk_wiz_1_100M
mb_1_wrapper_i_mb_1_i_axi_gpio_0
mb_1_wrapper_i_mb_1_i_mdm_1
mb_1_wrapper_i_mb_1_i_microblaze_0
mb_1_wrapper_i_mb_1_i_microblaze_0_axi_periph
mb_1_wrapper_i_mb_1_i_microblaze_0_local_memory_dlmb_bram_if_cntlr
mb_1_wrapper_i_mb_1_i_microblaze_0_local_memory_dlmb_v10
mb_1_wrapper_i_mb_1_i_microblaze_0_local_memory_ilmb_bram_if_cntlr
mb_1_wrapper_i_mb_1_i_microblaze_0_local_memory_ilmb_v10
mb_1_wrapper_i_mb_1_i_microblaze_0_local_memory_lmb_bram
mb_1_wrapper_i_mb_1_i_rst_clk_wiz_1_100M
common_wrapper_i_common_i_axi_gpio_0
common_wrapper_i_common_i_axi_interconnect_0
common_wrapper_i_common_i_clk_wiz_1
common_wrapper_i_common_i_rst_clk_wiz_1_100M

#为 bsp_out 目录中的处理器生成 BSP,并编译 bsp 源文件

hsi::generate_bsp -proc mb_2_wrapper_i_mb_2_i_microblaze_0 -dir bsp_out -
compile
ls ./bsp_out/mb_2_wrapper_i_mb_2_i_microblaze_0
code
indent
lib
libsrc